Polymer Adhesives and Encapsulants for Microelectronic Applications
نویسندگان
چکیده
his article provides an overview of the use of polymer adhesives in microelectronic packaging, with key applications including die attachment, underfills, and encapsulants. For many applications, polymer adhesives provide several advantages over alternative materials, and polymers have been widely used for die attachment. In flip-chip devices, polymers are being used for electrical interconnects instead of metallurgical joints. Polymer encapsulants are widely used to package microelectronic and optoelectronic devices when hermetic-ity is not required. The various types of materials and their properties are presented along with the relative advantages and disadvantages. Processing and assembly steps, testing, and reliability issues also are discussed.
منابع مشابه
Correlation between chemistry of polymer building blocks and microelectronics reliability
Among various materials, polymers are widely used in microelectronics as different product constituents, such as encapsulants, conductive or non-conductive adhesives, underfills, molding compounds, insulators, dielectrics, and coatings. The behavior of these polymer constituents determines the performance, such as functionality and reliability, of the final products. Therefore, the successful d...
متن کاملInfluence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging*
متن کامل
Applied Physics Reviews–focused Review
Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive bears the forces involved to hold the surfaces together. The main advantages of adhesive wafer bonding include...
متن کاملAutonomic Healing of Polymers
MRS BULLETIN • VOLUME 33 • AUGUST 2008 • www.mrs.org/bulletin Abstract Self-healing polymers have experienced rapid technological advancement over the past seven years. They have moved from a conceptual demonstration to practical application in this time frame and have grown from a single design to a generic paradigm for modern materials development. Potential applications of self-healing polym...
متن کاملVoiding and Reliability of Assembly of BGA with SAC and 57Bi42Sn1Ag Alloys
• Share with a friend Dr. Ning-Cheng Lee, Vice President of Technology, Indium Corporation, is a world-renown soldering expert and an SMTA Member of Distinction. He has nearly 30 years of experience in the development of fluxes and solder pastes for SMT industries. He has extensive experience in the development of high temperature polymers, encapsulants for microelectronics, underfills, and adh...
متن کامل